Revision history of "Bonding ball"

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  • (cur | prev) 00:15, 5 March 2019Mcmaster (talk | contribs). . (2,295 bytes) (+2,295). . (Created page with "= Introduction = Thermosonic ball bonding is the most common and cost effective method for general use on modern ICs. # The wire is fed through a ceramic capillary, shaped s...")